I have some questions about how chiplets and multi - die manufacturing works:-
1. What process node is used for the parts connecting the dies (if both die are from different foundries, one of them has to do the job of connecting everything?)
2. Do any of the open source tools have a concept of instantiating a design with multiple PDKs in different partitions + interconnects between them?
3. Are all dies usually from different foundries or just different processes from same foundry and are there companies that just do interposer / wiring connection before packaging for this type of stuff?
2:43 a.m.
also, if different foundries is possible, would it be possible for us to potentially do an ihp + gf tapeout using ihp's high speed rf devices and gf on other parts? (don't see any economic benefits here cz our scale is small but would be a cool experiment)
@rahulbhagwat - I believe @Matt G. (Mobius) has some students exploring mounting open source silicon on other open source silicon.
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6:56 a.m.
@rahulbhagwat - There are also people exploring wire bonding multiple open source silicon die together on to one PCB with other "commercial off the shelf" parts.
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6:58 a.m.
I'm hoping that if we can get wire bonding as part of PCBA from places like NextPCB, then everyone can have of "cheap" version of multi-part designs that the big groups have.
We were trying to mount two 1/4 size projects on a full size. We ended up having to bond from the bond pads on the top die to the existing IO pads on the bottom die.
Matt G. (Mobius)
We were trying to mount two 1/4 size projects on a full size. We ended up having to bond from the bond pads on the top die to the existing IO pads on the bottom die.
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